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[供應]SAC305/INDIUM10.1HF/TYPE4/89
- 產(chǎn)品產(chǎn)地：
- 產(chǎn)品品牌：Indium
- 包裝規(guī)格：
- 產(chǎn)品數(shù)量：0
- 計量單位：
- 產(chǎn)品單價：0
- 更新日期：2025-08-28 14:07:15
- 有效期至：2026-08-28
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SAC305/INDIUM10.1HF/TYPE4/89
詳細信息
Introduction
Indium10.1HFisanairreflow，no-clean，halogen-free，Pb-freesolderpastespecificallyformulatedtohaveultra-lowvoiding，includingfordesignsthatincorporatelargegroundpadsotherwiseknownasbottomterminationcomponents(BTCs).BTCsincludepackagessuchasQFNs，DPAKs，andMOSFETs.ThefluxchemistryisspecificallyengineeredtoimprovereliabilitybyminimizingvoidingandmaximizingECMandhead-in-pillowperformancewhilealsoprovidingexcellentwetting，solderbeading，solderballing，andslumptomeetIPCspecifications.Itiscompatiblewithlead-freealloyssuchasSnAgCu，SnAg，andotheralloysystemsfavoredbytheelectronicsindustry.
Features
Ultra-lowvoiding，includingbottomtermination(BTC)assemblies
HighECMperformanceunderlowstandoffcomponents
Outstandingsolderbeading，verylowbridging，slump，solderballing，andhead-in-pillow
Excellentwettingtofreshandagedcommonmetallizationsandsurfacefinishes，including，butnotlimitedto:
OSP
ImmersionSn
ImmersionAg
ENIG
Exceptionalprinting—hightransferefficiencyandlowvariation
Halogen-freeperIEC61249-2-21，testmethodEN14582
Alloys
IndiumCorporationmanufactureslow-oxidesphericalpowdercomposedofavarietyofPb-freealloysthatcoverabroadrangeofmeltingtemperatures.Type3andType4powdersarestandardofferingswithPb-freealloys.Themetalpercentistheweightpercentofthesolderpowderinthesolderpasteandisdependentuponthepowdertypeandapplication.Standardproductofferingsaredetailedinthespecificationstable.
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